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High-Quality Printed Circuit Boards, Creating Lasting Value for Our Clients

Features - Rigid PCB's Standard Advanced Notes
Double Sided Panel Sizes 18" x 24" 21" x 24"
Multilayer Panel Sizes 18" x 24" 21" x 24"
Maximum Board Thickness .125" .200"
Maximum Layers 12 30
Minimum Core Dielectric Thickness .003" .002"
Minimum Prepreg Dielectric Thickness .003" .002"
Minimum Copper Weight - Inner Layer (oz) 1/2 oz N/A
Minimum Starting Copper Weight - Outer Layer (oz) 3/8 oz 1/4 oz
Maximum Copper Weight - Inner Layer (oz) 6 oz 8 oz
Maximum Starting Copper Weight - Outer Layer (oz) 2 oz 14 oz
Technology Standard Advanced Notes
Seqential Lamination 3X Lam Cycles 5X Lam Cyles
Buried/Blind Via No Yes
Backdrilling No Yes
Plugged Vias (mask) No Yes
Castellated Holes Yes Yes
Edge Plating Yes Yes
Via Fill - Conductive/Non-Conductive Yes Yes
Countersink/Counterbore/Beveling Yes Yes
Milling/Controlled Depth Yes Yes
Controlled Impedance Yes + / - 10% Yes + / - 5% 5% on 90ohms and above
Materials Standard Advanced Notes
Arlon 85N, 85HP Yes Yes
EMC EM-827, EM-370Z, EM-528, EM-890K Yes Yes
Nelco 4000-13 EP No Yes
Isola FR406 Yes Yes
Isola FR408, FR408HR Yes Yes
Isola 370HR Yes Yes
ITEQ IT180ATC Yes Yes
Tachyon 100G No Yes
Megtron 6 Yes Yes
I-Speed, IteraMT40 Yes Yes
Ventec VT47 Yes Yes
Rogers 4000 Series Yes Yes
Aismalibar (Cobritherm) ALCu-P Yes Yes
Aismalibar Flextherm Yes Yes
Final Finishes Standard Advanced Notes
HASL Yes Yes
LF HAL Yes Yes
ENIG Yes Yes
ENEPIG No Yes
Immersion Tin Yes Yes
Silver Yes Yes
OSP Yes Yes
Gold - Tabs Yes Yes Outside Service
Gold - Hard No Yes Outside Service
Gold - Soft No Yes Outside Service
Artwork Features Standard Advanced Notes
Minimum Inner Layer Line Width .004" .003"
Minimum Inner Layer Spacing .004" .003" Hoz Copper
Minimum Outer Layer Line Width .004" .003"
Minimum Outer Layer Spacing .003" .0025" Hoz Copper or Less
Minimum Pad Size .015" .008"
Drilling/Fabrication Standard Advanced Notes
Smallest Drill Size 0.008" 0.006"
Maximum Drill Aspect Ratio 8:1 10:1
Maximum Drill Size 0.250" 0.250"
Hole to Inner Layer Copper Minimum Spacing 0.008" 0.006"
Back Drilled Vias - Depth Tolerance + / - .005" + / - .003" under development
Blind / Buried Vias - Drilled .010" 0.0071"
Laser Drill .006" (Copper Filled) .005" (Copper Filled) Aspect Ratio .75:1
IL Copper to Board Edge - Routed .010" .007"
OL Copper to Board Edge - Routed .008" .005"
"V" Groove Scoring - Profile Tolerance + / - .010" Min Panel Thickness .031
Solder Mask Standard Advanced Notes
LPI Soldermask Green, Blue, Red, Clear Purple, Black, White
Minimum Clearance .002" .001"
Minimum Web .004" .003"
Legend Standard Advanced Notes
Legend Color White Black, Yellow, Orange
Legend Size .005" Thick / .050" Height .005" Thick / .050" Height

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Powering Your
Tech at Every Spec

High-Quality Printed Circuit Boards, Creating Lasting Value for Our Clients

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