PCB Manufacturing Capabilities
Features - Rigid PCB's | Standard | Advanced | Notes |
---|---|---|---|
Double Sided Panel Sizes | 18" x 24" | 21" x 24" | |
Multilayer Panel Sizes | 18" x 24" | 21" x 24" | |
Maximum Board Thickness | .125" | .200" | |
Maximum Layers | 12 | 30 | |
Minimum Core Dielectric Thickness | .003" | .002" | |
Minimum Prepreg Dielectric Thickness | .003" | .002" | |
Minimum Copper Weight - Inner Layer (oz) | 1/2 oz | N/A | |
Minimum Starting Copper Weight - Outer Layer (oz) | 3/8 oz | 1/4 oz | |
Maximum Copper Weight - Inner Layer (oz) | 6 oz | 8 oz | |
Maximum Starting Copper Weight - Outer Layer (oz) | 2 oz | 14 oz |
Technology | Standard | Advanced | Notes |
---|---|---|---|
Seqential Lamination | 3X Lam Cycles | 5X Lam Cyles | |
Buried/Blind Via | No | Yes | |
Backdrilling | No | Yes | |
Plugged Vias (mask) | No | Yes | |
Castellated Holes | Yes | Yes | |
Edge Plating | Yes | Yes | |
Via Fill - Conductive/Non-Conductive | Yes | Yes | |
Countersink/Counterbore/Beveling | Yes | Yes | |
Milling/Controlled Depth | Yes | Yes | |
Controlled Impedance | Yes + / - 10% | Yes + / - 5% | 5% on 90ohms and above |
Materials | Standard | Advanced | Notes |
---|---|---|---|
Arlon 85N, 85HP | Yes | Yes | |
EMC EM-827, EM-370Z, EM-528, EM-890K | Yes | Yes | |
Nelco 4000-13 EP | No | Yes | |
Isola FR406 | Yes | Yes | |
Isola FR408, FR408HR | Yes | Yes | |
Isola 370HR | Yes | Yes | |
ITEQ IT180ATC | Yes | Yes | |
Tachyon 100G | No | Yes | |
Megtron 6 | Yes | Yes | |
I-Speed, IteraMT40 | Yes | Yes | |
Ventec VT47 | Yes | Yes | |
Rogers 4000 Series | Yes | Yes | |
Aismalibar (Cobritherm) ALCu-P | Yes | Yes | |
Aismalibar Flextherm | Yes | Yes |
Final Finishes | Standard | Advanced | Notes |
---|---|---|---|
HASL | Yes | Yes | |
LF HAL | Yes | Yes | |
ENIG | Yes | Yes | |
ENEPIG | No | Yes | |
Immersion Tin | Yes | Yes | |
Silver | Yes | Yes | |
OSP | Yes | Yes | |
Gold - Tabs | Yes | Yes | Outside Service |
Gold - Hard | No | Yes | Outside Service |
Gold - Soft | No | Yes | Outside Service |
Artwork Features | Standard | Advanced | Notes |
---|---|---|---|
Minimum Inner Layer Line Width | .004" | .003" | |
Minimum Inner Layer Spacing | .004" | .003" | Hoz Copper |
Minimum Outer Layer Line Width | .004" | .003" | |
Minimum Outer Layer Spacing | .003" | .0025" | Hoz Copper or Less |
Minimum Pad Size | .015" | .008" |
Drilling/Fabrication | Standard | Advanced | Notes |
---|---|---|---|
Smallest Drill Size | 0.008" | 0.006" | |
Maximum Drill Aspect Ratio | 8:1 | 10:1 | |
Maximum Drill Size | 0.250" | 0.250" | |
Hole to Inner Layer Copper Minimum Spacing | 0.008" | 0.006" | |
Back Drilled Vias - Depth Tolerance | + / - .005" | + / - .003" | under development |
Blind / Buried Vias - Drilled | .010" | 0.0071" | |
Laser Drill | .006" (Copper Filled) | .005" (Copper Filled) | Aspect Ratio .75:1 |
IL Copper to Board Edge - Routed | .010" | .007" | |
OL Copper to Board Edge - Routed | .008" | .005" | |
"V" Groove Scoring - Profile Tolerance | + / - .010" | Min Panel Thickness .031 |
Solder Mask | Standard | Advanced | Notes |
---|---|---|---|
LPI Soldermask | Green, Blue, Red, Clear | Purple, Black, White | |
Minimum Clearance | .002" | .001" | |
Minimum Web | .004" | .003" |
Legend | Standard | Advanced | Notes |
---|---|---|---|
Legend Color | White | Black, Yellow, Orange | |
Legend Size | .005" Thick / .050" Height | .005" Thick / .050" Height |